BFR505
vs
BFY90-QR-B
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TT ELECTRONICS PLC
|
Part Package Code |
SOT-23
|
|
Package Description |
PLASTIC PACKAGE-3
|
CYLINDRICAL, O-MBCY-W4
|
Pin Count |
3
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.21.00.75
|
|
Samacsys Manufacturer |
NXP
|
|
Additional Feature |
LOW NOISE, HIGH RELIABILITY
|
LOW NOISE
|
Collector Current-Max (IC) |
0.018 A
|
0.025 A
|
Configuration |
SINGLE
|
SINGLE
|
DC Current Gain-Min (hFE) |
60
|
25
|
Highest Frequency Band |
L BAND
|
ULTRA HIGH FREQUENCY BAND
|
JEDEC-95 Code |
TO-236AB
|
TO-72
|
JESD-30 Code |
R-PDSO-G3
|
O-MBCY-W4
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
4
|
Operating Temperature-Max |
175 °C
|
200 °C
|
Package Body Material |
PLASTIC/EPOXY
|
METAL
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE
|
CYLINDRICAL
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Polarity/Channel Type |
NPN
|
NPN
|
Power Dissipation Ambient-Max |
0.15 W
|
0.2 W
|
Power Dissipation-Max (Abs) |
0.15 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
CECC
|
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
Tin (Sn)
|
|
Terminal Form |
GULL WING
|
WIRE
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Transition Frequency-Nom (fT) |
9000 MHz
|
1000 MHz
|
Base Number Matches |
11
|
2
|
Collector-Base Capacitance-Max |
|
1.5 pF
|
Collector-Emitter Voltage-Max |
|
15 V
|
|
|
|
Compare BFR505 with alternatives
Compare BFY90-QR-B with alternatives