BF998TRL vs BF998WR feature comparison

BF998TRL YAGEO Corporation

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BF998WR NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G4 MICRO MINIATURE, PLASTIC PACKAGE-4
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Case Connection SOURCE SOURCE
Configuration SINGLE SINGLE WITH BUILT-IN DIODE
JESD-30 Code R-PDSO-G4 R-PDSO-G4
Number of Elements 1 2
Number of Terminals 4 4
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Pin Count 4
Additional Feature LOW NOISE
DS Breakdown Voltage-Min 12 V
Drain Current-Max (ID) 0.03 A
FET Technology METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band ULTRA HIGH FREQUENCY BAND
JESD-609 Code e3
Operating Mode DUAL GATE, DEPLETION MODE
Operating Temperature-Max 150 °C
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 0.3 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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