BF998,215
vs
BF998
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
TELEFUNKEN MICROELECTRONICS GMBH
Part Package Code
SOT-143
Package Description
PLASTIC PACKAGE-4
Pin Count
4
Manufacturer Package Code
SOT143B
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.21.00.75
Samacsys Manufacturer
NXP
Additional Feature
LOW NOISE
Case Connection
SOURCE
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE
DS Breakdown Voltage-Min
12 V
Drain Current-Max (ID)
0.03 A
0.03 A
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
ULTRA HIGH FREQUENCY BAND
JESD-30 Code
R-PDSO-G4
JESD-609 Code
e3
e0
Number of Elements
1
1
Number of Terminals
4
Operating Mode
DUAL GATE, DEPLETION MODE
DUAL GATE, DEPLETION MODE
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
0.2 W
0.2 W
Qualification Status
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
AMPLIFIER
Transistor Element Material
SILICON
Base Number Matches
1
8
Compare BF998,215 with alternatives