BF861B
vs
BF851C
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOT-23
|
|
Package Description |
PLASTIC PACKAGE-3
|
CYLINDRICAL, O-PBCY-T3
|
Pin Count |
3
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.21.00
|
|
Samacsys Manufacturer |
NXP
|
|
Additional Feature |
LOW NOISE
|
LOW NOISE
|
Configuration |
SINGLE
|
SINGLE
|
DS Breakdown Voltage-Min |
25 V
|
25 V
|
FET Technology |
JUNCTION
|
JUNCTION
|
Feedback Cap-Max (Crss) |
2.7 pF
|
3 pF
|
JEDEC-95 Code |
TO-236AB
|
TO-92
|
JESD-30 Code |
R-PDSO-G3
|
O-PBCY-T3
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
DEPLETION MODE
|
DEPLETION MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE
|
CYLINDRICAL
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
0.25 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
BOTTOM
|
Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
10
|
3
|
|
|
|
Compare BF861B with alternatives
Compare BF851C with alternatives