BF841 YAGEO CorporationBuy Now Datasheet |
BF840,215 NXP SemiconductorsBuy Now Datasheet |
Part Life Cycle Code | Obsolete | Transferred |
---|---|---|
Ihs Manufacturer | PHILIPS COMPONENTS | NXP SEMICONDUCTORS |
Reach Compliance Code | unknown | compliant |
ECCN Code | EAR99 | EAR99 |
Collector Current-Max (IC) | 0.025 A | 0.025 A |
Collector-Emitter Voltage-Max | 40 V | 40 V |
Configuration | SINGLE | SINGLE |
Highest Frequency Band | ULTRA HIGH FREQUENCY BAND | |
JESD-30 Code | R-PDSO-G3 | R-PDSO-G3 |
Number of Elements | 1 | 1 |
Number of Terminals | 3 | 3 |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package Shape | RECTANGULAR | RECTANGULAR |
Package Style | SMALL OUTLINE | SMALL OUTLINE |
Polarity/Channel Type | NPN | NPN |
Qualification Status | Not Qualified | Not Qualified |
Surface Mount | YES | YES |
Terminal Form | GULL WING | GULL WING |
Terminal Position | DUAL | DUAL |
Transistor Application | AMPLIFIER | AMPLIFIER |
Transistor Element Material | SILICON | SILICON |
Transition Frequency-Nom (fT) | 380 MHz | 380 MHz |
Base Number Matches | 10 | 2 |
Rohs Code | Yes | |
Part Package Code | TO-236 | |
Package Description | PLASTIC, SST3, SMD, 3 PIN | |
Pin Count | 3 | |
Manufacturer Package Code | SOT23 | |
HTS Code | 8541.21.00.75 | |
DC Current Gain-Min (hFE) | 67 | |
JEDEC-95 Code | TO-236AB | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 150 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Power Dissipation-Max (Abs) | 0.28 W | |
Terminal Finish | TIN | |
Time@Peak Reflow Temperature-Max (s) | 30 | |