BF824TRL
vs
BF824
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
SMALL OUTLINE, R-PDSO-G3
PLASTIC PACKAGE-3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Collector Current-Max (IC)
0.025 A
0.025 A
Collector-Emitter Voltage-Max
30 V
30 V
Configuration
SINGLE
SINGLE
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
e3
Number of Elements
1
1
Number of Terminals
3
3
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Polarity/Channel Type
PNP
PNP
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
440 MHz
440 MHz
Base Number Matches
2
20
Part Package Code
SOT-23
Pin Count
3
Collector-Base Capacitance-Max
0.3 pF
JEDEC-95 Code
TO-236AB
Moisture Sensitivity Level
1
Operating Temperature-Max
150 °C
Power Dissipation-Max (Abs)
0.3 W
Transistor Application
AMPLIFIER
Compare BF824TRL with alternatives
Compare BF824 with alternatives