BF824-TAPE-13 vs BF824W,135 feature comparison

BF824-TAPE-13 NXP Semiconductors

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BF824W,135 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G3 PLASTIC, UMT3, SMD, SC-70, CMPAK-3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 0.025 A 0.025 A
Collector-Emitter Voltage-Max 30 V
Configuration SINGLE SINGLE
Highest Frequency Band VERY HIGH FREQUENCY BAND
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type PNP PNP
Power Dissipation Ambient-Max 0.25 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 440 MHz 250 MHz
Base Number Matches 1 2
Rohs Code Yes
Part Package Code SC-70
Pin Count 3
Manufacturer Package Code SOT323
HTS Code 8541.21.00.75
DC Current Gain-Min (hFE) 25
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 0.2 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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