BF824-TAPE-13
vs
BF824W,135
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
SMALL OUTLINE, R-PDSO-G3
PLASTIC, UMT3, SMD, SC-70, CMPAK-3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Collector Current-Max (IC)
0.025 A
0.025 A
Collector-Emitter Voltage-Max
30 V
Configuration
SINGLE
SINGLE
Highest Frequency Band
VERY HIGH FREQUENCY BAND
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
PNP
PNP
Power Dissipation Ambient-Max
0.25 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
440 MHz
250 MHz
Base Number Matches
1
2
Rohs Code
Yes
Part Package Code
SC-70
Pin Count
3
Manufacturer Package Code
SOT323
HTS Code
8541.21.00.75
DC Current Gain-Min (hFE)
25
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Power Dissipation-Max (Abs)
0.2 W
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
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