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BF824 vs BF824W,135 feature comparison

BF824 YAGEO Corporation

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BF824W,135 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G3 PLASTIC, UMT3, SMD, SC-70, CMPAK-3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 0.025 A 0.025 A
Collector-Emitter Voltage-Max 30 V
Configuration SINGLE SINGLE
Highest Frequency Band ULTRA HIGH FREQUENCY BAND
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Terminals 3 3
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type PNP PNP
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 440 MHz 250 MHz
Base Number Matches 3 1
Rohs Code Yes
Part Package Code SC-70
Pin Count 3
Manufacturer Package Code SOT323
HTS Code 8541.21.00.75
DC Current Gain-Min (hFE) 25
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 0.2 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30
Transistors » RF Small Signal Bipolar Transistors
Transistors » RF Small Signal Bipolar Transistors

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Compare BF824W,135 with alternatives