BF820 vs BF820W,135 feature comparison

BF820 TDK Micronas GmbH

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BF820W,135 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ITT SEMICONDUCTOR NXP SEMICONDUCTORS
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Collector-Base Capacitance-Max 1.6 pF 1.6 pF
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 50 50
JEDEC-95 Code TO-236
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Terminals 3 3
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 60 MHz 60 MHz
VCEsat-Max 0.6 V 0.6 V
Base Number Matches 1 1
Rohs Code Yes
Part Package Code SC-70
Package Description PLASTIC, SC-70, 3 PIN
Pin Count 3
Manufacturer Package Code SOT323
HTS Code 8541.21.00.95
Factory Lead Time 4 Weeks
Collector Current-Max (IC) 0.05 A
Collector-Emitter Voltage-Max 300 V
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 0.2 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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