BF570
vs
MRF524
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Part Package Code |
SOT-23
|
|
| Package Description |
PLASTIC PACKAGE-3
|
CYLINDRICAL, O-MBCY-W4
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Collector Current-Max (IC) |
0.1 A
|
0.05 A
|
| Collector-Base Capacitance-Max |
2.2 pF
|
1.5 pF
|
| Collector-Emitter Voltage-Max |
15 V
|
10 V
|
| Configuration |
SINGLE
|
SINGLE
|
| JEDEC-95 Code |
TO-236AB
|
TO-72
|
| JESD-30 Code |
R-PDSO-G3
|
O-MBCY-W4
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
4
|
| Operating Temperature-Max |
150 °C
|
200 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
METAL
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
NPN
|
PNP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
WIRE
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
500 MHz
|
4200 MHz
|
| Base Number Matches |
5
|
1
|
| Additional Feature |
|
LOW NOISE
|
| DC Current Gain-Min (hFE) |
|
25
|
| Highest Frequency Band |
|
S BAND
|
| Power Dissipation-Max (Abs) |
|
0.2 W
|
| Power Gain-Min (Gp) |
|
9 dB
|
|
|
|
Compare BF570 with alternatives
Compare MRF524 with alternatives