BF256A
vs
BF245A/0
feature comparison
Pbfree Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
NXP SEMICONDUCTORS
|
Part Package Code |
TO-92 (TO-226) 5.33mm Body Height
|
|
Package Description |
CASE 29, 3 PIN
|
|
Pin Count |
3
|
|
Manufacturer Package Code |
29-11
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Samacsys Manufacturer |
onsemi
|
|
Configuration |
SINGLE
|
SINGLE
|
DS Breakdown Voltage-Min |
30 V
|
30 V
|
FET Technology |
JUNCTION
|
JUNCTION
|
Highest Frequency Band |
ULTRA HIGH FREQUENCY BAND
|
VERY HIGH FREQUENCY BAND
|
JEDEC-95 Code |
TO-92
|
TO-92
|
JESD-30 Code |
O-PBCY-T3
|
O-PBCY-T3
|
JESD-609 Code |
e0
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
DEPLETION MODE
|
DEPLETION MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
Peak Reflow Temperature (Cel) |
235
|
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
0.3 W
|
0.3 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
9
|
1
|
Drain Current-Max (ID) |
|
0.025 A
|
Transistor Application |
|
AMPLIFIER
|
|
|
|
Compare BF256A with alternatives
Compare BF245A/0 with alternatives