BF244C
vs
2N3823
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
MICROSEMI CORP
|
| Package Description |
CYLINDRICAL, O-PBCY-W3
|
TO-72, 4 PIN
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SINGLE
|
SINGLE
|
| DS Breakdown Voltage-Min |
30 V
|
30 V
|
| Drain Current-Max (ID) |
0.1 A
|
|
| FET Technology |
JUNCTION
|
JUNCTION
|
| Highest Frequency Band |
ULTRA HIGH FREQUENCY BAND
|
VERY HIGH FREQUENCY BAND
|
| JEDEC-95 Code |
TO-92
|
TO-206AF
|
| JESD-30 Code |
O-PBCY-W3
|
O-MBCY-W4
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
4
|
| Operating Mode |
DEPLETION MODE
|
DEPLETION MODE
|
| Operating Temperature-Max |
150 °C
|
200 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
0.36 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Transistor Application |
AMPLIFIER
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
12
|
12
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
BCY
|
| Pin Count |
|
4
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
| Feedback Cap-Max (Crss) |
|
2 pF
|
|
|
|
Compare BF244C with alternatives
Compare 2N3823 with alternatives