BDX18
vs
2N3055ESMD.MOD
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
CRIMSON SEMICONDUCTOR INC
|
TT ELECTRONICS PLC
|
| Package Description |
FLANGE MOUNT, O-MBFM-P2
|
HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.95
|
|
| Collector Current-Max (IC) |
15 A
|
15 A
|
| Collector-Emitter Voltage-Max |
60 V
|
60 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
20
|
20
|
| JEDEC-95 Code |
TO-3
|
TO-276AB
|
| JESD-30 Code |
O-MBFM-P2
|
R-CBCC-N3
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
3
|
| Operating Temperature-Max |
175 °C
|
|
| Package Body Material |
METAL
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
CHIP CARRIER
|
| Polarity/Channel Type |
PNP
|
NPN
|
| Power Dissipation Ambient-Max |
115 W
|
|
| Power Dissipation-Max (Abs) |
117 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
PIN/PEG
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
2 MHz
|
2.5 MHz
|
| VCEsat-Max |
1 V
|
|
| Base Number Matches |
1
|
2
|
| Case Connection |
|
COLLECTOR
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare BDX18 with alternatives
Compare 2N3055ESMD.MOD with alternatives