BDW23 vs BDW23 feature comparison

BDW23 Bourns Inc

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BDW23 Samsung Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer BOURNS INC SAMSUNG SEMICONDUCTOR INC
Part Package Code TO-220AB SFM
Package Description PLASTIC, TO-220, FM-3 TO-220, 3 PIN
Pin Count 3 3
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
Case Connection COLLECTOR
Collector Current-Max (IC) 6 A 6 A
Collector-Emitter Voltage-Max 45 V 45 V
Configuration DARLINGTON DARLINGTON
DC Current Gain-Min (hFE) 100 750
JEDEC-95 Code TO-220AB TO-220AB
JESD-30 Code R-PSFM-T3 R-PSFM-T3
Number of Elements 1 1
Number of Terminals 3 3
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Application SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 8 4
JESD-609 Code e0
Operating Temperature-Max 150 °C
Power Dissipation-Max (Abs) 50 W
Terminal Finish TIN LEAD

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