BDT60A vs TIP125 feature comparison

BDT60A Bourns Inc

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TIP125 NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer BOURNS INC NXP SEMICONDUCTORS
Part Package Code SFM TO-220AB
Package Description FLANGE MOUNT, R-PSFM-T3 PLASTIC, TO-220, 3 PIN
Pin Count 3 3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 4 A 5 A
Collector-Emitter Voltage-Max 80 V 60 V
Configuration DARLINGTON DARLINGTON
DC Current Gain-Min (hFE) 750 1000
JEDEC-95 Code TO-220AB TO-220AB
JESD-30 Code R-PSFM-T3 R-PSFM-T3
Number of Elements 1 1
Number of Terminals 3 3
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type PNP PNP
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Element Material SILICON SILICON
Base Number Matches 6 52
Transistor Application SWITCHING

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