BD9B301MUV-LBE2
vs
TPSM828213SILR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
TEXAS INSTRUMENTS INC
|
| Package Description |
HVQCCN,
|
Module-10
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
13 Weeks
|
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
Texas Instruments
|
| Additional Feature |
ADJUSTABLE OUTPUT MODE FROM 0.8 TO 4.4V
|
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.7 V
|
2.4 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
S-XQCC-N16
|
R-XDMA-N10
|
| Length |
3 mm
|
2.5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
10
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
3.5 A
|
1 A
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
DMA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Seated Height-Max |
1 mm
|
1.1 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Switching Frequency-Max |
2000 kHz
|
4000 kHz
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
3 mm
|
2 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Moisture Sensitivity Level |
|
2
|
| Number of Outputs |
|
1
|
| Output Voltage-Max |
|
4 V
|
| Output Voltage-Min |
|
0.6 V
|
| Output Voltage-Nom |
|
2.5 V
|
|
|
|
Compare BD9B301MUV-LBE2 with alternatives
Compare TPSM828213SILR with alternatives