BD675
vs
BD677
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
STMICROELECTRONICS
|
| Part Package Code |
TO-225
|
SIP
|
| Package Description |
PLASTIC, CASE 77-09, 3 PIN
|
ROHS COMPLIANT PACKAGE-3
|
| Pin Count |
3
|
3
|
| Manufacturer Package Code |
77-09
|
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
4 Weeks
|
29 Weeks, 4 Days
|
| Samacsys Manufacturer |
onsemi
|
STMicroelectronics
|
| Collector Current-Max (IC) |
4 A
|
4 A
|
| Collector-Emitter Voltage-Max |
45 V
|
60 V
|
| Configuration |
DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
|
DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
|
| DC Current Gain-Min (hFE) |
750
|
750
|
| JEDEC-95 Code |
TO-225AA
|
TO-126
|
| JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
235
|
NOT SPECIFIED
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation-Max (Abs) |
40 W
|
40 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Transistor Application |
AMPLIFIER
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
10 MHz
|
10 MHz
|
| Base Number Matches |
5
|
2
|
| Rohs Code |
|
Yes
|
| HTS Code |
|
8541.29.00.95
|
| Case Connection |
|
ISOLATED
|
| Power Dissipation Ambient-Max |
|
40 W
|
| VCEsat-Max |
|
2.5 V
|
|
|
|
Compare BD675 with alternatives
Compare BD677 with alternatives