BD3830FS-E2 vs TPA6130A2YZH feature comparison

BD3830FS-E2 ROHM Semiconductor

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TPA6130A2YZH Texas Instruments

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROHM CO LTD TEXAS INSTRUMENTS INC
Part Package Code SSOP BGA
Package Description SSOP, VFBGA,
Pin Count 32 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Channel Separation 80 dB
Consumer IC Type TONE CONTROL CIRCUIT VOLUME CONTROL CIRCUIT
Harmonic Distortion 0.005%
JESD-30 Code R-PDSO-G32 S-XBGA-B16
Length 13.6 mm 2.29 mm
Number of Bands 2
Number of Channels 2 2
Number of Functions 1 1
Number of Terminals 32 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SSOP VFBGA
Package Equivalence Code SOP32,.3,32 BGA16,4X4,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 0.625 mm
Supply Voltage-Max (Vsup) 9.5 V 5.5 V
Supply Voltage-Min (Vsup) 7 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position DUAL BOTTOM
Width 5.4 mm 2.29 mm
Base Number Matches 1 1
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

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