BD243C vs TIP147 feature comparison

BD243C Samsung Semiconductor

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TIP147 Rochester Electronics LLC

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Part Life Cycle Code Transferred Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC ROCHESTER ELECTRONICS LLC
Part Package Code SFM TO-218
Package Description TO-220, 3 PIN CASE 340D-02, 3 PIN
Pin Count 3 3
Reach Compliance Code unknown unknown
ECCN Code EAR99
Collector Current-Max (IC) 6 A 10 A
Collector-Emitter Voltage-Max 100 V 100 V
Configuration SINGLE DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE) 15 500
JEDEC-95 Code TO-220AB TO-218
JESD-30 Code R-PSFM-T3 R-PSFM-T3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN PNP
Power Dissipation-Max (Abs) 65 W
Qualification Status Not Qualified COMMERCIAL
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 3 MHz 4 MHz
Base Number Matches 1 2
Pbfree Code No
Manufacturer Package Code CASE 340D-02
Case Connection COLLECTOR
JESD-609 Code e0
Peak Reflow Temperature (Cel) 240
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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