BD243C vs TIP147 feature comparison

BD243C Samsung Semiconductor

Buy Now Datasheet

TIP147 JW Miller

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC POWER INNOVATIONS LTD
Part Package Code SFM
Package Description TO-220, 3 PIN FLANGE MOUNT, R-PSFM-T3
Pin Count 3 3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 6 A
Collector-Emitter Voltage-Max 100 V
Configuration SINGLE
DC Current Gain-Min (hFE) 15
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3 R-PSFM-T3
Number of Elements 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN
Power Dissipation-Max (Abs) 65 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON
Transition Frequency-Nom (fT) 3 MHz
Base Number Matches 1 1

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