BCX71J,235 vs BCX71J feature comparison

BCX71J,235 NXP Semiconductors

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BCX71J TDK Micronas GmbH

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS ITT SEMICONDUCTOR
Part Package Code TO-236
Package Description PLASTIC PACKAGE-3
Pin Count 3
Manufacturer Package Code SOT23
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.21.00.95
Additional Feature LOW NOISE
Collector Current-Max (IC) 0.1 A 0.2 A
Collector-Emitter Voltage-Max 45 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 250 250
JEDEC-95 Code TO-236AB
JESD-30 Code R-PDSO-G3
JESD-609 Code e3 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type PNP PNP
Power Dissipation-Max (Abs) 0.25 W 0.25 W
Qualification Status Not Qualified
Surface Mount YES YES
Terminal Finish TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING
Transistor Element Material SILICON
Transition Frequency-Nom (fT) 100 MHz
Turn-off Time-Max (toff) 800 ns
Turn-on Time-Max (ton) 150 ns
VCEsat-Max 0.55 V
Base Number Matches 2 26

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