BCV62C,235 vs BCV62C,215 feature comparison

BCV62C,235 Nexperia

Buy Now Datasheet

BCV62C,215 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G4 PLASTIC PACKAGE-4
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Date Of Intro 2017-02-01
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 30 V 30 V
Configuration CURRENT MIRROR CURRENT MIRROR
DC Current Gain-Min (hFE) 420 420
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 4 4
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type PNP PNP
Surface Mount YES YES
Terminal Finish TIN TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 100 MHz
Base Number Matches 2 2
Rohs Code Yes
Part Package Code SOT-143
Pin Count 4
Manufacturer Package Code SOT143B
HTS Code 8541.21.00.95
Factory Lead Time 4 Weeks
Additional Feature FOR TRANSISTOR2 HFE IS 420
Case Connection COLLECTOR
Operating Temperature-Max 150 °C
Qualification Status Not Qualified
VCEsat-Max 0.65 V

Compare BCV62C,235 with alternatives

Compare BCV62C,215 with alternatives