BCV62,235
vs
BCV62B,215
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOT-143
|
SOT-143
|
Package Description |
PLASTIC PACKAGE-4
|
PLASTIC PACKAGE-4
|
Pin Count |
4
|
4
|
Manufacturer Package Code |
SOT143B
|
SOT143B
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.21.00.95
|
8541.21.00.95
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
Case Connection |
COLLECTOR
|
COLLECTOR
|
Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
Collector-Emitter Voltage-Max |
30 V
|
30 V
|
Configuration |
CURRENT MIRROR
|
CURRENT MIRROR
|
DC Current Gain-Min (hFE) |
100
|
220
|
JESD-30 Code |
R-PDSO-G4
|
R-PDSO-G4
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
4
|
4
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Polarity/Channel Type |
PNP
|
PNP
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Transistor Element Material |
SILICON
|
SILICON
|
Transition Frequency-Nom (fT) |
100 MHz
|
100 MHz
|
VCEsat-Max |
0.65 V
|
0.65 V
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
NXP
|
Additional Feature |
|
FOR TRANSISTOR2 HFE IS 220
|
|
|
|
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