BCV61T/R vs BCV61B/T3 feature comparison

BCV61T/R NXP Semiconductors

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BCV61B/T3 Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Package Description PLASTIC PACKAGE-4 SMALL OUTLINE, R-PDSO-G4
Pin Count 4
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 30 V 30 V
Configuration COMMON BASE, 2 ELEMENTS COMMON BASE, 2 ELEMENTS
DC Current Gain-Min (hFE) 110 200
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e3
Number of Elements 2 2
Number of Terminals 4 4
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified
Surface Mount YES YES
Terminal Finish TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 100 MHz
VCEsat-Max 0.6 V
Base Number Matches 2 2
Date Of Intro 2017-02-01
Additional Feature FOR TRANSISTOR2 HFE IS 200
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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