BCV61T/R vs BCV61,215 feature comparison

BCV61T/R NXP Semiconductors

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BCV61,215 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description PLASTIC PACKAGE-4 PLASTIC, SMD, 4 PIN
Pin Count 4 4
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 30 V 30 V
Configuration COMMON BASE, 2 ELEMENTS CURRENT MIRROR
DC Current Gain-Min (hFE) 110 110
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e3 e3
Number of Elements 2 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 100 MHz
VCEsat-Max 0.6 V 0.6 V
Base Number Matches 2 2
Part Package Code SOT-143
Manufacturer Package Code SOT143B
HTS Code 8541.21.00.95
Moisture Sensitivity Level 1
Time@Peak Reflow Temperature-Max (s) 30

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