BCV61-A
vs
BCV61,235
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SIEMENS A G
NXP SEMICONDUCTORS
Package Description
SMALL OUTLINE, R-PDSO-G4
PLASTIC, SMD, 4 PIN
Reach Compliance Code
unknown
compliant
Case Connection
COLLECTOR
COLLECTOR
Collector Current-Max (IC)
0.2 A
0.1 A
Collector-Emitter Voltage-Max
30 V
30 V
Configuration
CURRENT MIRROR
CURRENT MIRROR
DC Current Gain-Min (hFE)
110
110
JESD-30 Code
R-PDSO-G4
R-PDSO-G4
Number of Elements
1
1
Number of Terminals
4
4
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
NPN
NPN
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
250 MHz
100 MHz
VCEsat-Max
0.6 V
0.6 V
Base Number Matches
1
2
Rohs Code
Part Package Code
SOT-143
Pin Count
4
Manufacturer Package Code
SOT143B
ECCN Code
EAR99
HTS Code
8541.21.00.95
Factory Lead Time
4 Weeks
JESD-609 Code
e3
Moisture Sensitivity Level
1
Operating Temperature-Max
150 °C
Peak Reflow Temperature (Cel)
260
Power Dissipation-Max (Abs)
0.25 W
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
Compare BCV61-A with alternatives
Compare BCV61,235 with alternatives