BCR1364JT vs TSR1FM364V feature comparison

BCR1364JT TT electronics / BI Technologies

Buy Now Datasheet

TSR1FM364V Tateyama Kagaku Group

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer BI TECHNOLOGIES CORP TATEYAMA KAGAKU GROUP
Package Description SMT, 2512
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Thick Film Chip
JESD-609 Code e0
Manufacturer Series BCR
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.6 mm
Package Length 6.3 mm 6.3 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 3.2 mm 3.2 mm
Packing Method TR, PAPER Tape
Rated Power Dissipation (P) 1 W 1 W
Rated Temperature 70 °C
Resistance 360000 Ω 360000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Series BCR
Size Code 2512 2512
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish TIN LEAD
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 200 V 200 V
Base Number Matches 2 1

Compare BCR1364JT with alternatives

Compare TSR1FM364V with alternatives