BCR135W vs PDTA144TM,315 feature comparison

BCR135W Siemens

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PDTA144TM,315 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SIEMENS A G NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G3 1 X 0.60 MM, 0.50 MM HEIGHT, LEAD LESS, ULTRA SMALL, PLASTIC, SC-101, 3 PIN
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.21.00.75
Additional Feature BUILT-IN BIAS RESISTOR RATIO IS 4.7 BUILT-IN BIAS RESISTOR
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 50 V 50 V
Configuration SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE) 70 100
JESD-30 Code R-PDSO-G3 R-PBCC-N3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE CHIP CARRIER
Polarity/Channel Type NPN PNP
Power Dissipation Ambient-Max 0.25 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING NO LEAD
Terminal Position DUAL BOTTOM
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 150 MHz
VCEsat-Max 0.3 V
Base Number Matches 3 1
Rohs Code Yes
Part Package Code DFN
Pin Count 3
Manufacturer Package Code SOT883
Factory Lead Time 4 Weeks
Case Connection COLLECTOR
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 0.25 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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