BCR1330JT
vs
TSR1FM330V
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TT ELECTRONICS PLC
TATEYAMA KAGAKU GROUP
Package Description
CHIP
Reach Compliance Code
unknown
unknown
Construction
Thick Film
Chip
JESD-609 Code
e0
Manufacturer Series
BCR
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
6.3 mm
6.3 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
3.2 mm
3.2 mm
Packing Method
TR, PAPER
Tape
Rated Power Dissipation (P)
1 W
1 W
Rated Temperature
70 °C
Resistance
33 Ω
33 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Series
BCR
Size Code
2512
2512
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
TIN LEAD
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
200 V
200 V
Base Number Matches
2
1
ECCN Code
EAR99
Compare BCR1330JT with alternatives
Compare TSR1FM330V with alternatives