BCR1/2333JT
vs
RM20JL333
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TT ELECTRONICS PLC
TA-I TECHNOLOGY CO LTD
Package Description
CHIP
Reach Compliance Code
unknown
compliant
Construction
Thick Film
Chip
JESD-609 Code
e0
e3
Manufacturer Series
BCR
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
5 mm
5 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.5 mm
2.5 mm
Packing Method
TR, PAPER
Tape, Paper
Rated Power Dissipation (P)
0.5 W
0.5 W
Rated Temperature
70 °C
Resistance
33000 Ω
33000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Series
BCR
Size Code
2010
2010
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
TIN LEAD
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
200 V
200 V
Base Number Matches
2
1
Rohs Code
Yes
ECCN Code
EAR99
Compare BCR1/2333JT with alternatives
Compare RM20JL333 with alternatives