BCR1/23010FE
vs
WCR20103010FELT
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
BI TECHNOLOGIES CORP
TT ELECTRONICS PLC
Package Description
SMT, 2010
SMT, 2010
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Construction
Thick Film
Chip
JESD-609 Code
e0
e0
Manufacturer Series
BCR
WCR
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.61 mm
Package Length
5 mm
5.003 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.5 mm
2.489 mm
Packing Method
TR, EMBOSSED
TR, PLASTIC
Rated Power Dissipation (P)
0.5 W
0.5 W
Rated Temperature
70 °C
70 °C
Resistance
301 Ω
301 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Series
BCR
WCR2010(F)
Size Code
2010
2010
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
2
1
Compare BCR1/23010FE with alternatives
Compare WCR20103010FELT with alternatives