BCP69E6433 vs BCP69,135 feature comparison

BCP69E6433 Siemens

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BCP69,135 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SIEMENS A G NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PSSO-G3 PLASTIC, SMD, SC-73, 4 PIN
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Configuration SINGLE SINGLE
JESD-30 Code R-PSSO-G3 R-PDSO-G4
Number of Elements 1 1
Number of Terminals 3 4
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position SINGLE DUAL
Transistor Application AMPLIFIER SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 2
Rohs Code Yes
Part Package Code SC-73
Pin Count 4
Manufacturer Package Code SOT223
HTS Code 8541.29.00.75
Collector Current-Max (IC) 1 A
Collector-Emitter Voltage-Max 20 V
DC Current Gain-Min (hFE) 60
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type PNP
Power Dissipation Ambient-Max 1.5 W
Power Dissipation-Max (Abs) 1.4 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30
Transition Frequency-Nom (fT) 40 MHz

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