BCP69-25,115 vs BCP69 feature comparison

BCP69-25,115 NXP Semiconductors

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BCP69 Motorola Semiconductor Products

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SC-73
Package Description PLASTIC, SMD, SC-73, 4 PIN PLASTIC, CASE 318E-04, 4 PIN
Pin Count 4
Manufacturer Package Code SOT223
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75 8541.29.00.75
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 1 A 1 A
Collector-Emitter Voltage-Max 20 V 25 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 160 60
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e3 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type PNP PNP
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 40 MHz 60 MHz
VCEsat-Max 0.5 V
Base Number Matches 1 3
JEDEC-95 Code TO-261AA
Power Dissipation Ambient-Max 1.5 W

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