BCP68,115 NXP SemiconductorsBuy Now Datasheet |
BCP68 Fairchild Semiconductor CorporationBuy Now Datasheet |
Rohs Code | Yes | Yes |
---|---|---|
Part Life Cycle Code | Transferred | Transferred |
Ihs Manufacturer | NXP SEMICONDUCTORS | FAIRCHILD SEMICONDUCTOR CORP |
Part Package Code | SC-73 | SOT-223 |
Package Description | PLASTIC, SMD, SC-73, 4 PIN | |
Pin Count | 4 | 4 |
Manufacturer Package Code | SOT223 | MOLDED PACKAGE, SOT-223, 4 LEAD |
Reach Compliance Code | compliant | compliant |
ECCN Code | EAR99 | EAR99 |
HTS Code | 8541.29.00.75 | |
Samacsys Manufacturer | NXP | |
Case Connection | COLLECTOR | COLLECTOR |
Collector Current-Max (IC) | 1 A | 1 A |
Collector-Emitter Voltage-Max | 20 V | 20 V |
Configuration | SINGLE | SINGLE |
DC Current Gain-Min (hFE) | 60 | 60 |
JESD-30 Code | R-PDSO-G4 | R-PDSO-G4 |
JESD-609 Code | e3 | e3 |
Moisture Sensitivity Level | 1 | 1 |
Number of Elements | 1 | 1 |
Number of Terminals | 4 | 4 |
Operating Temperature-Max | 150 °C | 150 °C |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package Shape | RECTANGULAR | RECTANGULAR |
Package Style | SMALL OUTLINE | SMALL OUTLINE |
Peak Reflow Temperature (Cel) | 260 | 260 |
Polarity/Channel Type | NPN | NPN |
Power Dissipation Ambient-Max | 1.5 W | |
Power Dissipation-Max (Abs) | 1.5 W | 1.5 W |
Qualification Status | Not Qualified | Not Qualified |
Surface Mount | YES | YES |
Terminal Finish | TIN | MATTE TIN |
Terminal Form | GULL WING | GULL WING |
Terminal Position | DUAL | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 | 30 |
Transistor Application | SWITCHING | AMPLIFIER |
Transistor Element Material | SILICON | SILICON |
Transition Frequency-Nom (fT) | 40 MHz | |
Base Number Matches | 1 | 5 |
Pbfree Code | Yes | |