BCP56-16/T3 vs BCP52 feature comparison

BCP56-16/T3 NXP Semiconductors

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BCP52 Fairchild Semiconductor Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SC-73 SOT-223
Package Description SMALL OUTLINE, R-PDSO-G4
Pin Count 4 4
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95
Case Connection COLLECTOR COLLECTOR
Configuration SINGLE SINGLE
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e3 e3
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Dissipation Ambient-Max 1.5 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 5
Pbfree Code Yes
Manufacturer Package Code MOLDED PACKAGE, SOT-223, 4 LEAD
Collector Current-Max (IC) 1.2 A
Collector-Emitter Voltage-Max 60 V
DC Current Gain-Min (hFE) 25
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type PNP
Power Dissipation-Max (Abs) 1.5 W
Time@Peak Reflow Temperature-Max (s) 30

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