BCP56-10TRL13 vs BCP56-10,115 feature comparison

BCP56-10TRL13 NXP Semiconductors

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BCP56-10,115 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SC-73 SC-73
Package Description SMALL OUTLINE, R-PDSO-G4 PLASTIC, SC-73, 4 PIN
Pin Count 4 4
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Configuration SINGLE SINGLE
JESD-30 Code R-PDSO-G4 R-PDSO-G4
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 2
Rohs Code Yes
Manufacturer Package Code SOT223
HTS Code 8541.29.00.75
Collector Current-Max (IC) 1 A
Collector-Emitter Voltage-Max 80 V
DC Current Gain-Min (hFE) 63
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type NPN
Power Dissipation Ambient-Max 1.5 W
Power Dissipation-Max (Abs) 1.5 W
Reference Standard AEC-Q101; IEC-60134
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30
Transition Frequency-Nom (fT) 180 MHz

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Compare BCP56-10,115 with alternatives