BCP56,135
vs
BCP56
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Package Description
,
SOT-223, 3 PIN
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Base Number Matches
2
23
Pbfree Code
Rohs Code
Part Package Code
SOT-223
Pin Count
4
Manufacturer Package Code
MOLDED PACKAGE, SOT-223, 4 LEAD
HTS Code
8541.29.00.95
Case Connection
COLLECTOR
Collector Current-Max (IC)
1.2 A
Collector-Emitter Voltage-Max
80 V
Configuration
SINGLE
DC Current Gain-Min (hFE)
25
JEDEC-95 Code
TO-261AA
JESD-30 Code
R-PDSO-G4
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
1
Number of Terminals
4
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Polarity/Channel Type
NPN
Power Dissipation-Max (Abs)
1 W
Qualification Status
Not Qualified
Surface Mount
YES
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
SWITCHING
Transistor Element Material
SILICON
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