BCP56,115
vs
BCP56
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
SIEMENS A G
Part Package Code
SC-73
Package Description
PLASTIC, SC-73, 4 PIN
Pin Count
4
Manufacturer Package Code
SOT223
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
8541.29.00.75
Case Connection
COLLECTOR
COLLECTOR
Collector Current-Max (IC)
1 A
1 A
Collector-Emitter Voltage-Max
80 V
80 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
40
40
JESD-30 Code
R-PDSO-G4
R-PDSO-G4
JESD-609 Code
e3
e0
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
4
4
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Polarity/Channel Type
NPN
NPN
Power Dissipation Ambient-Max
1.5 W
1.5 W
Power Dissipation-Max (Abs)
1.5 W
1.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
AEC-Q101; IEC-60134
Surface Mount
YES
YES
Terminal Finish
TIN
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
180 MHz
100 MHz
Base Number Matches
2
23
VCEsat-Max
0.5 V
Compare BCP56,115 with alternatives
Compare BCP56 with alternatives