BCP55-TAPE-13 vs BCP55-16,115 feature comparison

BCP55-TAPE-13 NXP Semiconductors

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BCP55-16,115 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G4
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 1 A 1 A
Collector-Emitter Voltage-Max 60 V 60 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 25 100
JESD-30 Code R-PDSO-G4 R-PDSO-G4
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 130 MHz 130 MHz
VCEsat-Max 0.5 V
Base Number Matches 1 1
Rohs Code Yes
Part Package Code SC-73
Pin Count 4
Manufacturer Package Code SOT223
HTS Code 8541.29.00.75
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Power Dissipation Ambient-Max 1.5 W
Power Dissipation-Max (Abs) 1.5 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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