BCP53-T vs BCP53,115 feature comparison

BCP53-T NXP Semiconductors

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BCP53,115 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G4 PLASTIC, SC-73, 4 PIN
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95 8541.29.00.75
Case Connection COLLECTOR COLLECTOR
Configuration SINGLE SINGLE
JESD-30 Code R-PDSO-G4 R-PDSO-G4
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Dissipation Ambient-Max 1.5 W 1.5 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 2
Rohs Code Yes
Part Package Code SC-73
Pin Count 4
Manufacturer Package Code SOT223
Collector Current-Max (IC) 1 A
Collector-Emitter Voltage-Max 80 V
DC Current Gain-Min (hFE) 63
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type PNP
Power Dissipation-Max (Abs) 1.5 W
Reference Standard AEC-Q101; IEC-60134
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30
Transition Frequency-Nom (fT) 145 MHz

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