BCM847DS,135
vs
BCM847DS/T1
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
TSOP
|
TSOP
|
Package Description |
PLASTIC, SC-74, TSOP-6
|
PLASTIC, SC-74, TSOP-6
|
Pin Count |
6
|
6
|
Manufacturer Package Code |
SOT457
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.21.00.75
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
Collector-Emitter Voltage-Max |
45 V
|
45 V
|
Configuration |
SEPARATE, 2 ELEMENTS
|
SEPARATE, 2 ELEMENTS
|
DC Current Gain-Min (hFE) |
200
|
200
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
2
|
2
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Polarity/Channel Type |
NPN
|
NPN
|
Power Dissipation-Max (Abs) |
0.38 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Transition Frequency-Nom (fT) |
250 MHz
|
250 MHz
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
|
|
|
Compare BCM847DS,135 with alternatives
Compare BCM847DS/T1 with alternatives