BCM847DS,115
vs
BCM847DS/T1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
TSOP
Package Description
PLASTIC, SC-74, TSOP-6
SMALL OUTLINE, R-PDSO-G6
Pin Count
6
Manufacturer Package Code
SOT457
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.21.00.75
Factory Lead Time
4 Weeks
Case Connection
ISOLATED
ISOLATED
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
45 V
45 V
Configuration
SEPARATE, 2 ELEMENTS
SEPARATE, 2 ELEMENTS
DC Current Gain-Min (hFE)
200
200
JESD-30 Code
R-PDSO-G6
R-PDSO-G6
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
2
2
Number of Terminals
6
6
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
0.38 W
Qualification Status
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
250 MHz
250 MHz
Base Number Matches
1
1
Date Of Intro
2017-02-01
Compare BCM847DS,115 with alternatives
Compare BCM847DS/T1 with alternatives