BC859-B
vs
BC859BT/R
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
KEC CORP
NXP SEMICONDUCTORS
Package Description
SMALL OUTLINE, R-PDSO-G3
PLASTIC PACKAGE-3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
30 V
30 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
220
220
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
PNP
PNP
Power Dissipation-Max (Abs)
0.35 W
0.3 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Transistor Application
SWITCHING
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
150 MHz
100 MHz
Base Number Matches
4
3
Rohs Code
Part Package Code
SOT-23
Pin Count
3
Additional Feature
LOW NOISE
JEDEC-95 Code
TO-236AB
JESD-609 Code
e3
Peak Reflow Temperature (Cel)
260
Terminal Finish
MATTE TIN
VCEsat-Max
0.65 V
Compare BC859-B with alternatives
Compare BC859BT/R with alternatives