BC856BE6327 vs BC856B,235 feature comparison

BC856BE6327 Siemens

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BC856B,235 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SIEMENS A G NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G3 PLASTIC, SST3, SMD, 3 PIN
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.21.00.75 8541.21.00.95
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 65 V 65 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 220 220
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type PNP PNP
Power Dissipation Ambient-Max 0.33 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 250 MHz 100 MHz
VCEsat-Max 0.65 V 0.65 V
Base Number Matches 3 2
Rohs Code Yes
Part Package Code TO-236
Pin Count 3
Manufacturer Package Code SOT23
Factory Lead Time 4 Weeks
JEDEC-95 Code TO-236AB
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 0.25 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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