BC850CW,135
vs
BC850CT/R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
SC-70
Package Description
SMALL OUTLINE, R-PDSO-G3
,
Pin Count
3
Manufacturer Package Code
SOT323
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.21.00.95
Additional Feature
LOW NOISE
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Base Capacitance-Max
3 pF
Collector-Emitter Voltage-Max
45 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
420
420
JESD-30 Code
R-PDSO-G3
JESD-609 Code
e3
e3
Number of Elements
1
1
Number of Terminals
3
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Polarity/Channel Type
NPN
NPN
Qualification Status
Not Qualified
Surface Mount
YES
YES
Terminal Finish
Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Transistor Application
AMPLIFIER
Transistor Element Material
SILICON
Transition Frequency-Nom (fT)
100 MHz
100 MHz
VCEsat-Max
0.6 V
Base Number Matches
2
3
Power Dissipation-Max (Abs)
0.3 W
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