BC850CLT1 vs BC850B,235 feature comparison

BC850CLT1 Motorola Semiconductor Products

Buy Now Datasheet

BC850B,235 NXP Semiconductors

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.21.00.95 8541.21.00.95
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Base Capacitance-Max 4.5 pF
Collector-Emitter Voltage-Max 45 V 45 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 420 200
JEDEC-95 Code TO-236AB TO-236AB
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 0.225 W
Power Dissipation-Max (Abs) 0.225 W 0.25 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish Tin/Lead (Sn/Pb) TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 100 MHz
VCEsat-Max 0.6 V 0.6 V
Base Number Matches 7 2
Part Package Code TO-236
Package Description PLASTIC PACKAGE-3
Pin Count 3
Manufacturer Package Code SOT23
Additional Feature LOW NOISE
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING

Compare BC850B,235 with alternatives