BC850BW-AU_R1_000A1
vs
BC850BW,135
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
PAN JIT INTERNATIONAL INC
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
PLASTIC, UMT3, SMD, SC-70, CMPAK-3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
| Collector-Emitter Voltage-Max |
45 V
|
45 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
200
|
200
|
| Number of Elements |
1
|
1
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Reference Standard |
AEC-Q101
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
100 MHz
|
100 MHz
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
SC-70
|
| Pin Count |
|
3
|
| Manufacturer Package Code |
|
SOT323
|
| HTS Code |
|
8541.21.00.95
|
| Factory Lead Time |
|
4 Weeks
|
| Additional Feature |
|
LOW NOISE
|
| Collector-Base Capacitance-Max |
|
3 pF
|
| JESD-30 Code |
|
R-PDSO-G3
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
3
|
| Operating Temperature-Max |
|
150 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
DUAL
|
| Transistor Application |
|
AMPLIFIER
|
| VCEsat-Max |
|
0.6 V
|
|
|
|
Compare BC850BW-AU_R1_000A1 with alternatives
Compare BC850BW,135 with alternatives