BC850BW,115
vs
BC850BLT1G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Part Package Code
SC-70
SOT-23
Package Description
PLASTIC, UMT3, SMD, SC-70, CMPAK-3
HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, 3 PIN
Pin Count
3
3
Manufacturer Package Code
SOT323
CASE 318-08
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8541.21.00.95
Factory Lead Time
4 Weeks
Additional Feature
LOW NOISE
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Base Capacitance-Max
3 pF
Collector-Emitter Voltage-Max
45 V
45 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
200
200
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
NOT SPECIFIED
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
NPN
NPN
Qualification Status
Not Qualified
COMMERCIAL
Surface Mount
YES
YES
Terminal Finish
TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Transistor Application
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
100 MHz
100 MHz
VCEsat-Max
0.6 V
Base Number Matches
2
2
Pbfree Code
JEDEC-95 Code
TO-236
Compare BC850BW,115 with alternatives
Compare BC850BLT1G with alternatives