BC850BR-TAPE-13
vs
BC850BW,115
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
SMALL OUTLINE, R-PDSO-G3
PLASTIC, UMT3, SMD, SC-70, CMPAK-3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Additional Feature
LOW NOISE
LOW NOISE
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
45 V
45 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
200
200
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
NPN
NPN
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
300 MHz
100 MHz
VCEsat-Max
0.6 V
0.6 V
Base Number Matches
1
2
Rohs Code
Yes
Part Package Code
SC-70
Pin Count
3
Manufacturer Package Code
SOT323
HTS Code
8541.21.00.95
Factory Lead Time
4 Weeks
Collector-Base Capacitance-Max
3 pF
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
AMPLIFIER
Compare BC850BR-TAPE-13 with alternatives
Compare BC850BW,115 with alternatives