BC850BR-TAPE-13 vs BC850BW,115 feature comparison

BC850BR-TAPE-13 NXP Semiconductors

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BC850BW,115 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G3 PLASTIC, UMT3, SMD, SC-70, CMPAK-3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Additional Feature LOW NOISE LOW NOISE
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 45 V 45 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 200 200
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 300 MHz 100 MHz
VCEsat-Max 0.6 V 0.6 V
Base Number Matches 1 2
Rohs Code Yes
Part Package Code SC-70
Pin Count 3
Manufacturer Package Code SOT323
HTS Code 8541.21.00.95
Factory Lead Time 4 Weeks
Collector-Base Capacitance-Max 3 pF
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application AMPLIFIER

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