BC850B/T4
vs
BC850BW,115
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Package Description |
SMALL OUTLINE, R-PDSO-G3
|
PLASTIC, UMT3, SMD, SC-70, CMPAK-3
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Date Of Intro |
2017-02-01
|
|
Additional Feature |
LOW NOISE
|
LOW NOISE
|
Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
Collector-Emitter Voltage-Max |
45 V
|
45 V
|
Configuration |
SINGLE
|
SINGLE
|
DC Current Gain-Min (hFE) |
200
|
200
|
JEDEC-95 Code |
TO-236AB
|
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Polarity/Channel Type |
NPN
|
NPN
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Transistor Application |
SWITCHING
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Transition Frequency-Nom (fT) |
100 MHz
|
100 MHz
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SC-70
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
SOT323
|
HTS Code |
|
8541.21.00.95
|
Factory Lead Time |
|
4 Weeks
|
Collector-Base Capacitance-Max |
|
3 pF
|
Operating Temperature-Max |
|
150 °C
|
Qualification Status |
|
Not Qualified
|
VCEsat-Max |
|
0.6 V
|
|
|
|
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